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HANDYLINK?
APPLICATION SPECIFICATION
5.2.3 Reflow Profile
While the production solder reflow profile is typically established by the customer, based on their specific application, generic reflow
profiles can be found in Product Specification PS-44828-001. The profiles are provided for reference purposes only.
5.2.4 Inspection
Solder joints should be inspected using established conventional methods.
5.3 45339 Plug Module for Wire Termination
5.3.1 Applicable Wire Sizes
Copper conductor size: 22 to 34 AWG (stranded wires are recommended for flexibility) may be used,
however, 22 to 28 AWG conductors are necessary to transmit 1.5 Amperes DC continuously.
Maximum insulation diameter: 1.6mm
NOTE: Small conductor sizes are suitable for the transmission of digital signals, and may improve wire bundle flexibility and harness
workability.
5.3.2 Wire Preparation
Strip length: 2.0 ~ 2.5mm
Pre-tinning is recommended.
5.3.3 Inspection
Solder joints should be inspected using established conventional methods .
5.4 45593 Plug Module for PCB Termination
5.4.1 PCB Layout
See the applicable Sales Drawing for an illustration of the recommended PCB hole layout.
5.4.2 Inspection
Solder joints should be inspected using established conventional methods .
REVISION:
A
ECR/ECN INFORMATION:
EC No: UCP2006- 1391
DATE: 2005/12/13
TITLE:
APPLICATION SPECIFICATION
HANDYLINK?I/O CONNECTOR SYSTEM
SHEET No.
8 of 26
DOCUMENT NUMBER:
SD-45339-001
CREATED / REVISED BY:
M. Simmel
CHECKED BY:
Marc Simmel
APPROVED BY:
Joe Comerci
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
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